OFC 2025 Live Demo: ATOP’s 1.6T OSFP224 DR8 SiPh Module in Action for Next-Gen AI

Blog OFC 2025 Live Demo: ATOP’s 1.6T OSFP224 DR8 SiPh Module in Action for Next-Gen AI

At OFC 2025, ATOP will globally unveil its groundbreaking 1.6T OSFP224 DR8 silicon photonics transceiver module — with live demonstrations onsite. Designed for AI computing networks, hyperscale data centers, and high-performance computing platforms, this product leverages cutting-edge silicon photonics chips and innovative high-speed optical packaging technology to meet the stringent demands of next-generation AI clusters for bandwidth density, energy efficiency, and long-reach interconnectivity.

Currently undergoing critical customer testing, the module will premiere its real-device live demonstration globally at Booth #5451 during OFC 2025. We cordially invite industry peers to join us in witnessing how silicon photonics technology is revolutionizing AI computing infrastructure and propelling the leap into the era of trillion-parameter AI models.

Silicon Photonics Advantages

High Integration, Low Power, Massive Bandwidth

Featuring a breakthrough silicon photonic Mach-Zehnder modulator, the module achieves 212.5Gbps PAM4 signaling per channel, enhancing optical link linearity and stability. Monolithic integration minimizes packaging complexity while ensuring superior signal integrity.

Product Highlights

Plug-and-Play

Hot-pluggable OSFP224 form factor with compliance to OSFP MSA specifications, enabling flexible deployment and seamless upgrades.

Ultra-High-Speed Interconnect

1.6Tbps total bandwidth via 8×212.5Gbps PAM4 optical/electrical interfaces, meeting the ultra-high-speed interconnect demands of AI clusters and cloud networks.

Versatile Fiber Connectivity

Supports MPO-16 or dual MPO-12 interfaces, compatible with diverse cabling environments. Upgrades from 800G to 1.6T without infrastructure overhaul.

Reliable Performance

Silicon Photonics PIC and PIN PD receiver technology ensure low-noise, high-sensitivity optical signal transmission and reception.

Robust Thermal Tolerance

Operates reliably across 0°C to 70°C commercial temperature ranges, engineered for harsh data center conditions.

Typical Tx eye diagram with 106.25GBd SSPRQ, TDECQ 1.78dB

As AI advancements drive exponential demand for high-speed, energy-efficient, and highly integrated optical solutions, ATOP’s 1.6T OSFP224 DR8 module not only addresses current AI and hyperscale data center needs but also lays the foundation for future high-performance computing applications.

Join us at OFC 2025 to experience this groundbreaking live demo and discover its transformative potential for AI infrastructure.

Booth #5451

Date: April 1-3, 2025

Location: Moscone Convention Center, San Francisco, CA

About ATOP

A global leader in optical connectivity solutions, ATOP specializes in high-speed optical modules and copper interconnect technologies, empowering hyperscale data centers, 5G networks, and AI-driven infrastructure worldwide.